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Special Economic Measures (Russia) Regulations (SOR/2014-58)

Regulations are current to 2025-12-10 and last amended on 2025-11-06. Previous Versions

SCHEDULE 5.1(Subsections 3.06(1) and (2))Goods and Technologies

  • Interpretation

    1 In this Schedule, development, electronic assembly, energetic material, production, required, software and use have the same meaning as under the heading “Definitions of Terms Used in Groups 1 And 2” of A Guide to Canada’s Export Control List, published by the Department of Foreign Affairs, Trade and Development, as amended from time to time.

  • Non-application

    2 This Schedule does not apply to goods or technologies that are subject to export control under the Export Control List, unless the good or technology is described in item 5400 of Group 5 of the schedule to that List.

Goods and Technologies

Column 1Column 2
ItemGoods and TechnologiesChemical Abstracts Service (CAS) Registry NumberFootnote for Goods and Technologies1, if applicable
1Equipment, electronic assemblies and components, specially designed for quantum computersFootnote for Goods and Technologies2, quantum electronics, quantum sensors, quantum processing units, qubit circuits, qubit devicesFootnote for Goods and Technologies3 or quantum radar systems.
2Cryogenic refrigeration systemsFootnote for Goods and Technologies4 designed to maintain temperatures below 1.1 kelvin for 48 hours or more and cryogenic refrigeration equipment and components therefor, as follows:
  • (a) pulse tubes;

  • (b) cryostats;

  • (c) dewars;

  • (d) gas handling systems;

  • (e) compressors; and

  • (f) control units.

3Ultra-high vacuum (UHV)Footnote for Goods and Technologies5 equipment, as follows:
  • (a) UHV sublimation, turbomolecular, diffusion, cryogenic, or ion-getter pumps; and

  • (b) UHV pressure gauges.

4High quantum efficiency photodetectors with a quantum efficiency greater than 80% in the wavelength range exceeding 300 nanometres but not exceeding 1700 nanometres.
5Manufacturing equipment, as follows:
  • (a) additive manufacturing equipment for the production of metal parts, as follows:

  • (i) powder-bed systems using selective laser melting, laser cladding, direct metal laser sintering or electron beam melting, or

  • (ii) powder-fed systems using laser cladding, direct energy deposition or laser metal deposition;

  • (b) additive manufacturing equipment for energetic materials, including equipment using ultrasonic extrusion; and

  • (c) vat photopolymerization additive manufacturing equipment using stereo lithography or direct light processing.

6Metal powders and metal alloy powders usable for the additive manufacturing equipment referred to in Item 5(a).
7Microscopes, related equipment and detectors, as follows:
  • (a) scanning electron microscopes;

  • (b) scanning auger microscopes;

  • (c) transmission electron microscopes;

  • (d) atomic force microscopes;

  • (e) scanning force microscopes; and

  • (f) equipment and detectors specially designed for use with the microscopes referred to in paragraphs (a) to (e), employing any of the following:

  • (i) x-ray photo spectroscopy,

  • (ii) energy-dispersive x-ray spectroscopy,

  • (iii) electron back scatter detector systems, or

  • (iv) electron spectroscopy for chemical analysis.

8DecapsulationFootnote for Goods and Technologies6 equipment for semiconductor devices.
9Software specially designed or modified for the development, production or use of the systems, equipment and components referred to in Items 1 to 8.
10Software for digital twins of additive manufactured products or for the determination of the reliability of additive manufactured products.
11Technology required for the development, production or use of the systems, equipment, components or software referred to in Items 1 to 10.
12Equipment for oil production or oil exploration, as follows:
  • (a) drill heads with integrated measurement equipment and inertial navigation systems for measurement while drilling (MWD);

  • (b) gas monitoring systems and detectors therefor, designed for detection of hydrogen sulphide;

  • (c) equipment for seismological measurements, including reflection seismetics and seismic vibrators; and

  • (d) sediment echo sounders.

13Collector equipment for metal ores in deep seabed.
14Equipment for the production of printed electronics for organic light-emitting diodes (OLED), organic field-effect transistors (OFET) and organic photovoltaic cells (OPVC).
15Equipment for the production of microelectromechanical systems (MEMS) using the mechanical properties of silicon, including sensors in chip format like pressure membranes, bending beams and micro adjustment devices.
16Equipment specially designed for the production of e-fuels (electrofuels and synthetic fuels) or ultra-efficient solar cells (efficiency greater than 30%).
17Numerically controlled machine tools having one or more linear axis with a travel length greater than 8 000 mm.
18Advanced materials, as follows:
  • (a) materials for cloaking or adaptive camouflage;

  • (b) metamaterials, including with a negative refractive index;

  • (c) high entropy alloys (HEA);

  • (d) Heusler compounds; and

  • (e) Kitaev materials, including Kitaev spin liquids.

19Conjugated polymers (conductive, semiconductive or electroluminescent) for printed or organic electronics.
20Energetic materials and mixtures thereof, except where the material is incorporated in a medical productFootnote for Goods and Technologies7, as follows:
  • (a) ammonium picrate;

131-74-8
  • (b) black powder;

  • (c) hexanitrodiphenylamine;

131-73-7
  • (d) difluoroamine;

10405-27-3
  • (e) nitrostarch;

9056-38-6
  • (f) tetranitronaphthalene;

  • (g) trinitroanisole;

  • (h) trinitronaphthalene;

  • (i) trinitroxylene;

  • (j) 1-methyl-2-pyrrolidinone;

872-50-4
  • (k) dioctyl maleate;

142-16-5
  • (l) 2-ethylhexyl acrylate;

103-11-7
  • (m) triethylaluminum (TEAL); trimethylaluminum and other pyrophoric metal alkyls and aryls of lithium, sodium, magnesium, zinc or boron;

97-93-8; 75-24-1
  • (n) nitroglycerin (or glycerol trinitrate; trinitroglycerin; NG);

55-63-0
  • (o) ethylenediamine, dinitrate (EDDN);

20829-66-7
  • (p) lead azide; lead styphnate; basic lead styphnate and primary explosives or priming compositions containing azides or azide complexes;

13424-46-9; 15245-44-0; 12403-82-6
  • (q) N,N'-diethyl-N,N'-diphenylurea; N,N'-dimethyl-N,N'diphenylurea; methylethyldiphenyl urea;

85-98-3; 611-92-7
  • (r) N,N-diphenylurea;

603-54-3
  • (s) methyl-N,N-diphenylurea (methyl unsymmetrical diphenylurea);

  • (t) N-methyl-N',N'-diphenylurea; N-ethyl-N',N'-diphenylurea;

13114-72-2; 64544-71-4
  • (u) 4-nitrodiphenylamine; and

836-30-6
  • (v) 2,2-dinitropropanol.

918-52-5
21Technology required for the development, production or use of the systems, equipment, components and software specified in items 12-19.
22Software specially designed or modified for the development, production or use of the systems, equipment and components specified in items 12-19.
23Nettings, canopies, tents, blankets and apparel, specially designed for camouflage.
24All-terrain vehicles.Footnote for Goods and Technologies8
25Lithium and lithium compounds, as follows:
  • (a) lithium;

7439-93-2
  • (b) lithium carbonate;

554-13-2
  • (c) lithium hydroxide; lithium hydroxide, monohydrate

1310-65-2; 1310-66-3
  • (d) lithium oxide;

12057-24-8
  • (e) lithium cobalt oxide;

12190-79-3
  • (f) lithium iron phosphate;

15365-14-7
  • (g) lithium manganese oxide;

12057-17-9
  • (h) lithium nickel manganese cobalt oxide; and

346417-97-8
  • (i) lithium titanate.

12031-82-2
26Ultra-high-molecular-weight polyethylene (UHMWPE) presented in any of the following forms:
  • (a) primary forms;

9002-88-4
  • (b) filament yarns or monofilaments;

  • (c) filament tows;

  • (d) rovings;

  • (e) staples or chopped fibres;

  • (f) fabrics including protective garments made from UHMWPE; and

  • (g) pulps or flocks.

27Equipment for the manufacture of printed circuit boards (PCBs) and specially designed components and accessories therefor, as follows:
  • (a) film processing equipment;

  • (b) solder mask coating equipment;

  • (c) photo plotter equipment;

  • (d) plating or electroplating deposition equipment;

  • (e) vacuum chambers and presses;

  • (f) roll laminators;

  • (g) alignment equipment; and

  • (h) etching equipment.

28

Automated optical inspection equipment for testing printed circuit boards (PCBs), based on optical or electrical sensors and capable of detecting any of the following quality defects:

  • (a) spacing, area, volume or height;

  • (b) bill boarding;

  • (c) components (presence, absence, flipped, offset, polarity or skew);

  • (d) solder (bridging or insufficient solder joints);

  • (e) leads (insufficient paste or lifting);

  • (f) tombstoning; or

  • (g) electrical (shorts, opens, resistance, capacitance, power or grid performance).

29Printed circuit board (PCB) composite substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR-6, CEM-1,G-10, etc.).
30Multilayer printed circuit board (PCB) substrates containing at least one layer of any of the following materials:
  • (a) aluminum;

  • (b) polytetrafluoroethylene (PTFE); or

  • (c) ceramic materials (e.g. alumina, titanium oxide, etc.).

31Etchant chemicals, as followsFootnote for Goods and Technologies9:
  • (a) ferric chloride;

7705-08-0
  • (b) cupric chloride;

7447-39-4
  • (c) ammonium persulphate;

7727-54-0
  • (d) sodium persulphate; and

7775-27-1
  • (e) chemical preparations specially designed for etching and containing any of the chemicals included in this item.

32Copper foil with a minimum purity of 95% and of a thickness less than 100 μm (micrometres).
33Polymeric substances and films thereof with a thickness of less than 0.5 mm, as follows:
  • (a) aromatic polyimides;

  • (b) parylenes;

  • (c) benzocyclobutenes (BCBs); and

  • (d) polybenzoxazoles.

34Technology for the development, production or use of printed circuit boards (PCB).
35Aromatic polyamides (aramids) presented in any of the following forms:
  • (a) primary forms;

  • (b) filament yarn or monofilaments;

  • (c) filament tows;

  • (d) rovings;

  • (e) staple or chopped fibres;

  • (f) fabrics including protective garments made from aromatic polyamide; or

  • (g) pulp or flocks.

36NanomaterialsFootnote for Goods and Technologies10, as follows:
  • (a) semiconductor nanomaterials; and

  • (b) composite-based nanomaterials.

37Carbon-based nanomaterials, as follows:
  • (a) carbon nanotubes;

  • (b) carbon nanofibres;

  • (c) fullerenes;

  • (d) graphenes; and

  • (e) carbon onions.

38Technology required for the development, production or use of the systems, equipment, components and software specified in the items above relating to aromatic polyamides, nanomaterials and carbon-based nanomaterials.
39Rare earth metalsFootnote for Goods and Technologies11 and compounds that contain rare earth metals, in any form, including mixtures, whether or not intermixed or interalloyedFootnote for Goods and Technologies12.
40Tungsten, tungsten carbide and tungsten alloys, containing more than 90% tungsten by weight, in any form including scrap or waste.Footnote for Goods and Technologies13
41Ceramic frequency filters.
42Cermet trimmers.
43Reciprocating or rotary internal combustion piston engines.
44Electric motors.
  • Return to footnote 1The CAS registry numbers (assigned by the Chemical Abstracts Service division of the American Chemical Society) set out in column 2 are provided for reference purposes only.

  • Return to footnote 2Quantum computers perform computations that harness the collective properties of quantum states, such as superposition, interference and entanglement.

  • Return to footnote 3The units, circuits and devices referred to in this Item include those that use or are based on superconducting circuits, quantum annealing, ion traps, photonic interaction, silicon spin qubits and cold atoms.

  • Return to footnote 4Cryogenic refrigeration systems include dilution refrigeration systems, adiabatic demagnetization refrigerators and laser cooling systems.

  • Return to footnote 5UHV means 100 nanoPascals (nPa) or lower.

  • Return to footnote 6Decapsulation means the removal of a cap, lid, or encapsulating material from a packaged integrated circuit by mechanical, thermal or chemical methods.

  • Return to footnote 7Medical product means a pharmaceutical formulation designed for human administration in the treatment of medical conditions that is prepackaged for distribution as a clinical or medical product.

  • Return to footnote 8All-terrain vehicle means a wheeled or tracked vehicle, other than a snowmobile or work vehicle, designed primarily for recreational use or for the transportation of property or equipment exclusively on undeveloped road rights of way, marshland, open country or other unprepared surfaces and includes quad bikes, off-road vehicles and utility terrain vehicles.

  • Return to footnote 9Items 31 does not control chemical mixtures in which no individual chemical specified in item 31 constitutes more than 10% by the weight of the mixture.

  • Return to footnote 10For the purpose of this schedule, nanomaterial means a material that consists of particles with one or more external dimensions in the size range of 1 to 100 nm (nanometres) for more than 1% of their number size distribution; has internal or surface structures in one or more dimensions in the size range of 1 to 100 nm; or has a specific surface area by volume greater than 60 m2/cm3, excluding materials consisting of particles with a size lower than 1 nm.

  • Return to footnote 11Rare earth metals include scandium, yttrium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium and lutetium.

  • Return to footnote 12Item 39 does not prohibit compounds or mixtures in which no individual rare earth metal constitutes more than 5% by the weight of the compound or mixture.

  • Return to footnote 13Item 40 does not prohibit surgical or medical instruments.

 

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